|
project |
parameters (metric in brackets) |
notes |
|
r double-panel and multilayer |
|
size of the largest makeup |
32����20����800mm��508mm�� |
|
| inner minimum line width / distance
|
0.075m(3mil) |
|
|
minimum inner pad |
5min(0.13mm) |
means the welding ring width |
|
thinnest inner layer thickness |
4min(0.1mm) |
|
|
inner layer copper thickness |
1/2oz(17um) |
without copper |
|
the end of the thickness of the outer copper coil |
1/2oz(17um) |
|
|
complete thickness |
0.20-4.0mm |
|
|
complete the plate thickness tolerance |
thickness <1.0mm |
��12% |
4-8 layers |
|
thickness <2.0mm |
��8% |
4-8 layers |
|
��10% |
10 laminates |
|
thickness �� 2.0mm |
��10% |
|
inner surface treatment |
brown oxide |
|
layers |
2-16 |
|
multilayer layer alignment degree |
��3mil(��76um) |
|
minimum finished hole |
.2mm (8mil) hdi, except |
|
precision holes |
��2mil(��50um) |
|
slot tolerance |
��3mil(��75um) |
|
pth hole tolerance |
��2mil(��50um) |
|
non-plated through hole diameter tolerance |
��1mil(��25um) |
|
maximum aspect ratio hole plating |
10:1 |
|
hole wall copper thickness |
0.4-2mil(10-50um) |
|
outer layer of the bit precision graphics |
��3mil(0.075um) |
|
outer minimum line width / distance |
3mil/3mil(75um/75um) |
|
etching tolerance |
��1mil(��25um) |
|
solder thickness |
top line |
0.4-1.2mil(10-30um) |
|
r line around the corner |
��0.2mil(5um) |
|
substrate |
�� finished thickness 1.2 mil (�� finished copper thickness 30 um) |
|
solder mask hardness |
6h |
|
solder on the bit precision graphics |
��2mil(��50um) |
|
solder bridge minimum width |
3.0mil(75um) |
|
maximum aperture plug oil |
0.6mm |
|
surface treatment |
interpolation gold, full plate gilt, osp, |
|
nickel gold nickel layer thickness |
120u��/240u��(3um/6um) |
|
nickel gold gold layer thickness |
2u��/6u��(0.05um/0.15um) |
|
impedance control and tolerance |
�� 10% (difference test) |
|
line peel strength |
��61b/in(��107g/mm) |
|
warp |
��0.75% |
|
blind hole / buried via |
�� |
|
surface treatment |
|
technical