working procedure | project | process capability | remarks | |
classification | routine | special | ||
product | number of layers | floors 1-6 | ||
finished product shape | ±0.1mm | ±0.05mm | ||
dimensional tolerance | ||||
minimum size of finished product | 5*5mm | 3*3mm | ||
fpc plate thickness | single panel: 0.08-0.13mm | minimum: 0.05mm | receiving orders outside the normal capacity | |
double sided plate: 0.10-0.25mm | minimum: 0.08mm | need review before | ||
three layer plate: 0.20-0.25mm | minimum: 0.18mm | |||
four layer plate: 0.25-0.30mm | minimum: 0.20mm | |||
fpc plate thickness tolerance | single and double-sided plate: ± 0.03mm | |||
multilayer board: ± 0.05mm | ||||
gold finger area tolerance | ±0.03mm | |||
engineering | multilayer laminated structure | three layer board: 1 double and 1 single | 1 single | |
design | four layer board: 1 single, 1 double and 1 single; | 1 double 1 double / 1 single 1 single 1 single | ||
minimum distance between line edge and forming edge | 0.2mm | 0.1mm | to achieve 0.1mm, it needs to be made by laser or fine steel mold | |
mosaic size | length * width: within 250mm * 300mm | max. 250 * 500mm | beyond special abilities | |
process edge size | single panel: single side ≥ 7mm | unilateral ≥ 5mm | review before receiving orders | |
double sided plate: single side ≥ 7mm | unilateral ≥ 5mm | |||
multilayer board: single side ≥ 12mm | unilateral ≥ 10mm | |||
drill hole | borehole diameter | 0.1-6.35mm | minimum aperture 0.07mm | |
slot hole diameter | 0.8mm*1.5mm | 0.5-1.0mm | ||
bore tolerance | pth hole: ± 0.075mm | |||
npth hole: ± 0.05mm | ||||
hole position accuracy | primary drilling: ± 0.075mm | |||
secondary drilling: ± 0.1mm | ||||
copper plating | hole copper thickness | double sided board: 8-15um | according to customer requirements | beyond special abilities |
multilayer board: 12-18um | according to customer requirements | review before receiving orders | ||
line | ring edge of hole ring | double sided plate: 0.125mm | 0.1mm | |
outer layer of multilayer board: ≥ 0.125mm | 0.1mm | |||
inner layer of multilayer board: ≥ 0.15mm | 0.1mm | |||
pth hole rim | double sided plate: ≥ 0.1mm | |||
pad to line distance | outer layer of multilayer board: ≥ 0.1mm | 0.05mm | ||
inner layer of multilayer board: ≥ 0.15mm | 0.1mm | |||
npth hole cutting copper | ≥0.2mm | |||
grid size | 0.4mm * 0.4mm, 45 ° tilt | |||
film compensation | 1 / 3oz bottom copper: 0.02mm | |||
1 / 2oz bottom copper: 0.025mm | ||||
1oz bottom copper: 0.035mm | ||||
for the independent line, 0.15mm shall be added on the basis of overall compensation | ||||
minimum line width and line spacing | 1 / 2oz bottom copper: 0.05mm | |||
1oz bottom copper: 0.10mm | ||||
line alignment | ±0.075mm | |||
line coincidence | ±0.075mm | |||
etching tolerance | ±0.02mm | |||
fit | covering film window opening hole | drilling: 0.3mm | ||
minimum square window covering film | borehole: 0.7mm | |||
minimum window spacing of covering film | drilling: 0.5mm | 0.3mm | ||
glue overflow of covering film | ≤0.15mm | |||
coating alignment | ≤0.2mm | ≤0.1mm | ||
printing | resistance welding window from pad | 0.10mm | ||
unilateral minimum distance | 0.2mm | |||
minimum resistance bridge | 0.25mm | |||
resistance welding thickness | 10-25um | |||
minimum character line width | ≥0.13mm | |||
minimum character line height | ≥0.80mm | |||
minimum distance from character to pad | 0.30mm | |||
surface treatment | thickness of gold and nickel | 0.025um-0.075um/1-3um | ||
gold and nickel plating thickness | 0.025um-0.075um/1-3um |
0.1~0.25um |
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